समाचार Samāchār · Tech & AI · 10 November 2026

Paras and BroadPak plan a 3D chip packaging plant. India moves up the stack

Paras Semiconductors has partnered with San Jose’s BroadPak to build an advanced packaging and test facility in India. Chiplets and AI hardware are where packaging now decides performance.

A defence electronics company is moving into the part of the chip business that AI now depends on. Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has partnered with US-based BroadPak Corporation to develop an advanced heterogeneous integration and 3D packaging facility in India, PTI reported on 9 November. The facility is an OSAT unit: outsourced assembly, packaging and test.

The scope is the frontier of the field. Reports by PTI and Dataquest list 2.5D and 3D packaging, chiplet integration, hybrid bonding, wafer- and panel-level fan-out, co-packaged optics, and testing and qualification. The target markets are AI, data centres, high-performance computing, networking and strategic electronics. BroadPak is headquartered in San Jose, California and was founded in 2007. Dataquest reports that Paras gets access to BroadPak’s design, manufacturing and integration know-how, with technology transfer and training for Indian engineers. Munjal Sharad Shah, managing director of Paras Defence and Space Technologies, called the entry into semiconductors a strategic expansion. The companies have not disclosed the investment, the site or a timeline.

The deal lands in a busy week for India’s chip plans. Electronics and IT Secretary S. Krishnan has said India aims to build its own GPU within roughly 24 months under the upcoming India Semiconductor Mission 2.0, and called it a complex undertaking, IANS reported on 9 November. Amitesh Kumar Sinha, CEO of the India Semiconductor Mission, said on 5 November that 12 manufacturing projects have been approved and five are in commercial production.

Why packaging matters: modern AI chips are no longer one slab of silicon. They are several dies stitched together, with memory stacked close. How well they are joined decides speed and power use. A GPU designed in India will need this capability nearby. Credit goes to the engineers at Paras and BroadPak, and to the officials at MeitY and ISM who have kept the programme moving.

What a founder takes from it: Packaging is the layer of the chip stack India can win first. It needs engineers, process discipline and customers more than a leading-edge fab. Build it for the world’s AI hardware, and the GPU ambition gets a home of its own to land in.